专用集成电路与系统国家重点实验室
讲座信息
Highly Integrated Silicon Photonic SoCs for Next Generation High-Density Interconnects

报告人：Vladimir Stojanović（University of California, Berkeley）
时 间：2016年3月15日周二下午13:30-14:30
地 点：张江校区微电子楼369室

Abstract
Optical technology is poised to revolutionize short-reach interconnects. The leading candidate technology is silicon photonics, and the workhorse of such an interconnect is the optical modulator. Modulators have been improved dramatically in recent years, with a notable increase in bandwidth from the megahertz to the multigigahertz regime in just over half a decade. However, the demands of optical interconnects are significant, and many questions remain unanswered as to whether silicon can meet the required performance metrics. Minimizing metrics such as the device footprint and energy requirement per bit, while also maximizing bandwidth and modulation depth, is non-trivial. All of this must be achieved within an acceptable thermal tolerance and optical spectral width using CMOS-compatible fabrication processes. This Review discusses the techniques that have been (and will continue to be) used to implement silicon optical modulators, as well as providing an outlook for these devices and the candidate solutions of the future.

Biography
Vladimir Stojanovic is an Associate Professor of Electrical Engineering and Computer Science at University of California, Berkeley, and a Chief Faculty Director of the Berkeley Wireless Research Center for the 2016. His research interests include design, modeling and optimization of integrated systems, from CMOS-based VLSI blocks and interfaces to system design with emerging devices like NEM relays and silicon-photonics. He is also interested in design and implementation of energy-efficient electrical and optical networks, and digital communication techniques in high-speed interfaces and high-speed mixed-signal IC design.
Vladimir received his Ph.D. in Electrical Engineering from Stanford University in 2005, and the Dipl. Ing. degree from the University of Belgrade, Serbia in 1998. He was also with Rambus, Inc., Los Altos, CA, from 2001 through 2004 and with MIT as Associate Professor from 2005-2013. He received the 2006 IBM Faculty Partnership Award, and the 2009 NSF CAREER Award as well as the 2008 ICCAD William J. McCalla, 2008 IEEE Transactions on Advanced Packaging, and 2010 ISSCC Jack Raper best paper awards. He was an IEEE Solid-State Circuits Society Distinguished Lecturer for the 2012-2013 term.