| David Z. Pan
Department of Electrical and Computer Engineering
The University of Texas at Austin, TX 78712 时间：2016年12月28日周三11:00-12:00
地点：张江校区微电子楼369室 Abstract As the semiconductor industry enters the era of extreme scaling (14nm, 10nm, 7nm, and beyond?), IC design and manufacturing challenges are exacerbated, due to the adoption of multiple patterning and other emerging lithography technologies. Meanwhile, new technologies which enable equivalent scaling such as 2.5D/3D-IC have gained tremendous interests and initial industry adoption, and new devices such as nanophotonics are making their headway to break the interconnect scaling bottleneck. Furthermore, hardware security has become a major concern due to fab outsourcing, extensive IP reuse, etc., thus unique identification/authentication and various IP protection schemes are in high demand. This talk will discuss some key challenges and opportunities in bridging the design and technology gaps for future integrated circuits and systems, in terms of key objectives such as power/performance, manufacturability, reliability, and security. Biography David Z. Pan received his PhD degree in Computer Science from UCLA in 2000. He was a Research Staff Member at IBM T. J. Watson Research Center from 2000 to 2003. He is currently a Full Professor and holder of the Engineering Foundation Endowed Professorship #1 at the Department of Electrical and Computer Engineering, University of Texas at Austin. He has published over 250 refereed journal/conference papers and 8 US patents, and graduated 20 PhD students. He has served in many premier journal editorial boards and conference committees, including various leadership roles. He has received a number of awards, including the SRC Technical Excellence Award (2013), DAC Top 10 Author Award in Fifth Decade (2013), DAC Prolific Author Award (2013), ASP-DAC Frequently Cited Author Award (2015), 13 Best Paper Awards, Communications of ACM Research Highlights (2014), ACM/SIGDA Outstanding New Faculty Award (2005), NSF CAREER Award (2007), NSFC Overseas and Hong Kong/Macau Scholars Collaborative Research Award, SRC Inventor Recognition Award three times, IBM Faculty Award four times, UCLA Engineering Distinguished Young Alumnus Award (2009), UT Austin RAISE Faculty Excellence Award (2014), many international CAD contest awards, among others. He is a Fellow of IEEE and SPIE. |